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Semiconductors

The new era of semiconductors will enable transformational products for artificial intelligence (AI), 5G, automotive, networking, cloud and edge compute applications. Ubiquitous connectivity, low latency and faster data rates will enable billions of more smart devices. These devices will rely on advanced, low power FinFET designs and state-of-the-art 3D integrated circuit (IC) packaging technologies to deliver the required power, performance, area and reliability metrics.

Multiphysics analysis is critical for enabling these cutting-edge electronics systems to work reliably throughout their lifetime. ANSYS empowers customers with multiphysics simulations to simultaneously solve power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system to promote first-time silicon and system success. ANSYS simulation and modeling tools offer you early power budgeting analysis for high-impact design decisions and foundry-certified accuracy needed for IC signoff.

System-aware IC power efficiency, power integrity and reliability

At the core of every electronics system is a chip that must meet multiple conflicting requirements, such as high performance, increased functionality, power efficiency, reliability and low cost. Ensuring the chip meets power efficiency, power integrity and reliability requirements as both a stand-alone component and within the electronics system calls for a system-aware chip design methodology. ANSYS uniquely offers a suite of multiscale, multiphysics solutions to support a chip-package-system (CPS) design flow.

The ANSYS semiconductor portfolio of power efficiency, power integrity and reliability solutions achieves ISO 26262 “Tool Confidence Level 1” (TCL1) certification. This certification enables automotive IC designers to meet rigorous safety requirements for ADAS and autonomous applications. Auto chip makers can leverage ANSYS PowerArtist, ANSYS Totem and ANSYS RedHawk family of multiphysics simulations for all ISO 26262 safety-related development projects at any Automotive Safety Integrity Level.

Foundry certified accuracy

With the cost of designing and implementing a system-on-chip (SoC) ranging from $50 million to $200 million, first-time working silicon is a must. IC designers require the most accurate simulation solution and consider foundry certification as the ultimate proof of accuracy. ANSYS semiconductor solutions have been certified by all leading foundries since 2006.

Production-proven solutions

Our software has enabled thousands of successful tape-outs across multiple technology nodes.

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Testimonials

  • I would like to hereby express my vote of confidence in Qfinsoft, in their ability to service and provide a strong support to us as a company.  We have been a customer of Qfinsoft for over a year and I am pleased to compliment them on their impeccable service offered to us thus far

    - Nico Gunther, Powertech Transformers

  • Since the introduction of ANSYS, more students are using first principles and FEA to validate their designs. This year, more than 60% of the projects were using FEA as a standard approach for numerical calculation. This number shows the huge impact ANSYS, had on University of Pretoria. FEA is not anymore a specialised tool for few users but a standard engineering tool easily integrated in the design process.

    - Francesco Pietra, University of Pretoria

  • For their consulting, training and technical support, Qfinsoft (Pty) Ltd must be the first choice of any firm looking for CAE experts

    - Prof G Akdogan, Process Engineering, University of Stellenbosch

  • At Aerospace, we have successfully used the ANSYS suite of tools to design high-performance gas turbine engines. Throughout this program, Qfinsoft provided valuable support and assistance to accelerate the development of our models. Their accessibility, short-turn around times and willingness to go beyond what is expected make them an effective partner on our projects. 

    - Dr. Hannes Pretorius

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