Electromagnetics

ANSYS® Electromagnetic products help engineers design innovative and cost-effective electrical and electronic products, faster. ANSYS® software can uniquely simulate electromagnetic performance across component, circuit and system design, and can evaluate temperature, vibration and other critical mechanical effects within the design.

ANSYS® Electromagnetic products include:

  • ANSYS® Maxwell (low frequency)
  • ANSYS® HFSS (high frequency)
  • ANSYS® SIwave (signal integrity)
  • ANSYS® Q3D Extractor (quasi-static electromagnetic field simulations)
  • ANSYS® Icepak (thermal simulation)
  • ANSYS® Electronics Desktop (comprehensive electromagnetics)

Wireless and RF

Design, simulate and validate the performance of antennas, RF and microwave components using ANSYS® high-frequency electromagnetics design software. This platform, used for full system verification of ground-breaking RF and microwave designs, can be directly integrated with our EM solvers thanks to integrated microwave circuit and system modelling capabilities.

PCB and electronic packaging

The Chip-Package-System (CPS) from ANSYS® allows users to test power integrity, signal integrity and EMI analysis for high-speed electronic devices. Thermal analysis is automated and extensive analysis capabilities allow for chip-aware and system-aware simulation across the chip package board.

Electromechanical and power electronics

ANSYS® simulation software can be used to test motors, sensors and actuators with electronic control as well as interaction between these components. Optimised cooling strategies can be set up using the software to analyse thermal and mechanical variants that can have effects like NVH.

Thermal management for electronics

ANSYS® products allow engineers to optimise the thermal performance of components and systems during start-up and operating conditions.

Examples include:

  • IC packages
  • Printed circuit boards (PCBs)
  • Data centres
  • Power electronics
  • Electric motors

 

Downloads & Whitepapers

View our downloads and whiteparers:

Whitepaper

This white paper explores the factors behind the electronics explosion and the role of simulation in innovation product design. Innovation doesn’t just happen because you want it to.

Testimonials

  • I would like to hereby express my vote of confidence in Qfinsoft, in their ability to service and provide a strong support to us as a company.  We have been a customer of Qfinsoft for over a year and I am pleased to compliment them on their impeccable service offered to us thus far

    - Nico Gunther, Powertech Transformers

  • Since the introduction of ANSYS, more students are using first principles and FEA to validate their designs. This year, more than 60% of the projects were using FEA as a standard approach for numerical calculation. This number shows the huge impact ANSYS, had on University of Pretoria. FEA is not anymore a specialised tool for few users but a standard engineering tool easily integrated in the design process.

    - Francesco Pietra, University of Pretoria

  • For their consulting, training and technical support, Qfinsoft (Pty) Ltd must be the first choice of any firm looking for CAE experts

    - Prof G Akdogan, Process Engineering, University of Stellenbosch

  • At Aerospace, we have successfully used the ANSYS suite of tools to design high-performance gas turbine engines. Throughout this program, Qfinsoft provided valuable support and assistance to accelerate the development of our models. Their accessibility, short-turn around times and willingness to go beyond what is expected make them an effective partner on our projects. 

    - Dr. Hannes Pretorius

Our Clients