Electromagnetic, Electronics, Thermal & Electromechanical Simulation

ANSYS electromagnetic field simulation helps you design innovative electrical and electronic products faster and more cost-effectively. In today’s world of high performance electronics and advanced electrification systems, the effects of electromagnetic fields on circuits and systems cannot be ignored. ANSYS software can uniquely simulate electromagnetic performance across component, circuit and system design, and can evaluate temperature, vibration and other critical mechanical effects. This unmatched electromagnetic-centric design flow helps you achieve first-pass system design success for advanced communication systems, high-speed electronic devices, electromechanical components and power electronics systems.

Wireless and RF

ANSYS high-frequency electromagnetics design software enables you to design, simulate and validate the performance of antennas and RF and microwave components. The integrated microwave circuit and system modeling capabilities have direct integration to our EM solvers delivering a platform for full-system verification of next-generation RF & microwave designs.

PCB and electronic packaging

The ANSYS Chip-Package-System (CPS) design flow delivers unparalleled simulation capacity and speed for power integrity, signal integrity and EMI analysis of high-speed electronic devices. Automated thermal analysis and integrated structural analysis capabilities complete the industry’s most comprehensive chip-aware and system-aware simulation solution across the chip-package-board.

Electromechanical and power electronics

ANSYS electromechanical and power electronics simulation software is ideal for applications which depend on the robust integration of motors, sensors, and actuators with electronics controls. ANSYS software simulates the interactions between these components and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise-vibration-harshness (NVH).

Electronics Thermal Management

ANSYS electronics thermal management solutions leverage advanced solver technology with robust, automatic meshing to enable you to rapidly perform heat transfer and fluid flow simulation for convective and forced air cooling strategies. Our solutions help you design cooling strategies to avoid excessive temperatures that degrade the performance of IC packages, printed circuit boards (PCBs), data centers, power electronics and electric motors.

Flagship Products

HFSS Maxwell
HFSS simulates 3-D full-wave electromagnetic fields for accurate design of high-frequency and high-speed electronic components. HFSS offers powerful solver technologies based on finite element, integral equation, asymptotic and advanced hybrid methods to solve microwave, RF and high-speed digital challenges.
Maxwell is a comprehensive electromagnetic field simulation software for the design of motors, actuators, transformers and other electrical and electromechanical devices. Maxwell can solve static, frequency-domain and time-varying electromagnetic and electric fields.



Before a product becomes smart, connected or immersive, it must first incorporate electronic components. Consumer demand for system autonomy, increased wireless content, improved thermal performance and power efficiency is driving significant manufacturer demand for robust electronic and electromechanical design processes. ANSYS 18 delivers key new functionalities to address these product development challenges and opportunities, focusing on automated simulation and design workflows for antennas, high speed electronics and electric machines.

With ANSYS 18, you can now simulate large-scale electronic platforms using the new streamlined antenna and wireless design workflow with an enhanced antenna design kit, broadband adaptive meshing and the integration of HFSS SBR+ (shooting and bouncing ray) capabilities for large-scale electromagnetic simulation. The chip-package-system workflow extends its system assembly capabilities by linking ECAD and MCAD with transient circuit simulation and IC models. The low frequency electromagnetic design flow is now enhanced with the automated Time Decomposition Method (TDM) for rapid and HPC-scalable simulations, along with magnetostriction analysis linking electrical, thermal and structural domains.

Now you can simulate antennas in large electronic platforms with SBR+ in HFSS

The ANSYS HFSS SBR+ solver has been integrated into the HFSS desktop. HFSS SBR+ predicts performance of antennas mounted to large electronic platforms such as automobiles, aircraft, ships or within urban environments — problems previously considered too large to solve.

Get faster, more efficient results with automated broadband adaptive meshing

The new Broadband Adaptive Meshing solution fully automates the ability of HFSS to efficiently and quickly refine the mesh across a device’s frequency spectrum. Now you simply select the low and high frequencies, and HFSS automatically refines the mesh using information across the entire frequency band and optimizes the mesh considering all of the results.

Now you can perform 3-D layout assembly with integrated transient circuit simulation

ANSYS 18 introduces the new capability to perform transient circuit simulation of ECAD and MCAD assemblies directly from layout for full system verification. Engineers can assemble an electronic system with IC packages, sockets, printed circuit boards and connectors, then perform electromagnetics plus transient circuit analysis of that system automatically.



ANSYS HFSS 3D Layout extracts frequency domain information and attaches it to a transient time domain simulation to solve 3-D models of PCB layouts.

Get faster results than ever with Maxwell TDM auto-setup on HPC clusters

ANSYS 18 offers a new auto set-up for the Time Decomposition Method (TDM) for ANSYS Maxwell. Any engineer can automatically launch Maxwell TDM jobs on an HPC cluster while maximizing performance and providing the most efficient use of that cluster. The TDM algorithms have also been optimized to enhance scalability as the problem size gets larger.

Design efficient, quiet electric motors

A new multiphysics capability in ANSYS 18 enables you to link ANSYS Maxwell and ANSYS Mechanical to simulate effects of magnetostriction in motors and transformers. With magnetostriction coupling, you are now empowered to deliver high performance, reliable motors and transformers that are quiet and efficient.

 For a on-site demonstration on Electronics simulation please contact us.



Electronics Whitepapers

  • The Role of Simulation in Innovative Electronic Design

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Electronics Brochures

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